CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
This NIST CHIPS Incentives Program funds construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. Applicants must be a 'covered en…
- Deadline
- Nov 1, 2026
- Posted
- Sep 29, 2023
- Award amount
- Amount not specified
Don’t miss this deadline
We’ll email you before Nov 1, 2026 so you have time to apply.
In plain English
This NIST CHIPS Incentives Program funds construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. Applicants must be a 'covered entity,' defined as a nonprofit, private-sector entity, or a consortium of such entities with demonstrated ability to substantially finance and build large semiconductor-related facilities. This is aimed at established firms and consortia capable of major capital projects, not individuals, researchers, or small or new organizations; applications go through the CHIPS Incentives Portal. No award amounts are specified, but the program targets large-scale industrial projects.
AI-generated summary to help you decide quickly — verify the official eligibility rules before applying.
Who can apply
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
About this grant
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov . If you have any questions on how to apply, please email apply@chips.gov.
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